Jun. 17, 2024
The electronics manufacturing business is characterized by a high level of professionalism. Individuals who have knowledge in this domain tend to use fundamental abbreviations to express their requirements, including but not limited to PCB (printed circuit board), PCBA (PCB assembly), and Through Hole Technology (THT), among others.
For more information, please visit Smt Vs Smd LED.
In addition, it is worth noting that the acronyms SMT (Surface Mount Technology) and SMD (Surface Mount Device) frequently appear in relevant discourse. However, what do they entail? Which is better, SMD or SMT, and why?
Well, there is a common confusion between these two abbreviated terms within the realm of electronics manufacturing. The distinction between Surface Mount Technologies (SMTs) and Surface Mount Devices (SMDs) extends beyond a mere terminology discrepancy, including many factors. Primarily, one may be characterized as a procedural operation while the other can be classified as a device.
Here, we&#;ll highlight the distinctions between the two abbreviations. That&#;s not all, however; you&#;ll also learn every detail of each phrase, beginning with its meaning.
Surface Mount Technology (SMT): What Is It?
Surface mount technology means mounting and soldering parts onto a circuit board. This technology gained widespread use in the electronics industry in the s. Costs decreased, and efficiency increased as methods and technologies were fine-tuned. SMT has helped electronic companies and their customers save money by reducing the number of devices used in their products while also improving performance, adding features, and decreasing error rates.
Smaller parts, a more streamlined production process, fewer mistakes, and more efficiency contribute to significantly reduced manufacturing costs. Industries that depend on flawless performance have taken notice because of these advantages.
There has been a rise in the use of SMT in several industries, including consumer electronics, transportation, healthcare, and communications. These sectors could not have grown and expanded without SMT, eliminating the need for a less effective and more prone to mistakes procedure.
Basic Concept
Surface mount technology, or SMT, is a technique for assembling printed circuit boards. It involves directly mounting electrical and electronic components onto the PCBs&#; surfaces.
This method involves applying solder paste to the surface of the boards to achieve accurate alignment of a stencil. The stencil guides the pick-and-place machine as it places explicitly the components on the boards. Afterward, the boards are heated in infrared ovens to soften the solder paste and form the solder connections.
Characteristics of SMT
&#; SMT makes it easier to create compact electronics or gadgets
&#; This technology helps minimize parasitic capacitance as well as inductance
&#; It cuts down on the number of needed PCBA parts
&#; Modern, automated machinery allows for consistent, high-output
SMT Assembly Process
Printing
Before printing, the SMT instrument places the stencil over the patched area of the PCB board. Squeegeeing the stencil outward deposits solder paste onto the appropriate solder joints via the openings.
Mounting
The solder paste serves as a temporary glue while a pick-and-place machine precisely positions the SMD components.
Reflow Soldering
Reflow soldering is the process of melting and solidifying solder paste, which is currently in a semi-liquid condition. It helps create a strong solder connection. The SMT method often employs reflow soldering when working with small-pin parts like ball grid arrays. It allows for exact temperature control and consistent heat distribution, leading to excellent solder joints.
Testing and Inspection
After the SMT process flow finishes, the manufacturer performs several inspection procedures to test for component position, solder bridges, short circuits, etc. These checks use various methods, including manual inspection, AOI inspection, and others.
To install every part securely, SMT assemblers use just the proper quantity of solder paste. Component mounting on the PCB can also be automated by instructing a machine to do it. It not only speeds up the manufacturing and delivery times but also guarantees correctness.
Surface Mount Device (SMD): What Is It?
A surface-mounted device (SMD) is nothing but an electrical part connected to a circuit board. The very effective and accurate SMT is what inspired the development of SMDs.
Basic Concept
SMDs, or surface-mounted devices, are electronic parts that are connected to circuit boards during assembly. Their compact size directly results from the market&#;s need for more efficient and affordable technological devices.
As technology became smaller and more complex in the latter half of the 20th century and towards the 21st century, through-hole methods became obsolete. Traditional parts were not only bulkier but also installed more slowly. SMDs employ pins rather than wire leads to connect to the board&#;s pads. Because no holes need to be drilled, the whole board may be put to good use rather than wasted.
SMD Characteristics
&#; Leads are either absent or very short on an SMD.
&#; It minimizes through-holes on PCBs, thereby preventing manufacturing mistakes.
&#; Improved efficiency despite reduced size
&#; It allows the solder joints and the SMD body to be on the same side.
SMD Components
Just 20 years after their introduction, SMD components have grown to dominate the industry. Surface mount devices are quite popular these days due to their growing use. You will find a great diversity in SMD components. Below you will find a list of all important SMD components.
Resistor:
The SMD resistor is often surface-mounted using SMT technology. However, its installation requires extra care. They usually have electrodes connected on each end. These are available in two types, including thick and thin film. When talking about the surface mounts, you will come across the term R-packs. These are resistor networks that help save placement time.
Ceramic Capacitor:
SMD SMT chip technology is essential for mounting SMD ceramic capacitors. They are used in areas where high-frequency circuits are crucial, such as motor engines, communication machinery, and aircraft systems. These are among the most useful and reliable SMD components. You can find them widely used in automotive, military devices, and aerospace applications.
Transistor (SOT):
It consists of surface-mounted devices with three or four leads. Companies use them on electronic devices to switch or expand electrical power. They are used on many electronic devices, including radio, audio and video equipment, etc. It is basically a semiconductor device that helps amplify or control electronic signals.
Integrated Circuit (IC):
Resistors, transistors, and capacitors are only a few of the components that make up an integrated circuit, often known as an IC chip. Basically, engineers use IC programming and semiconductor processing to build a small PCB with targeted capabilities.
Also Read: A Closer Look at IC Pin Inspection With Bi-Telecentric Lenses
In short, SMD components are those that are surface-mounted on the PCBA board and rely on surface-mounted technology to perform their intended tasks. It is common practice to use surface-mount devices (SMDs) in PCB manufacturing since they align with the downsizing trend and assure assembly quality.
What Are the Major Differences Between SMD and SMT?
Although they have similar words in their names, SMT and SMD refer to two different things. To attach and solder surface mount parts to a board is known as surface mount technology (SMT), whereas surface mount devices (SMD) are the electronic components themselves.
The phrases surface-mount device and surface-mount technology often appear combined when discussing PCB assembly. But you may better understand what goes into making an electrical gadget if you know the distinctions between these two concepts and how they interact with one another.
Different Objectives:
Surface Mount Technology (SMT) aims to provide automation and exact installation in order to enable efficient manufacturing. However, the primary goals of using surface-mount device (SMD) electronic components inside electronic systems are downsizing and easy integration of multiple components.
Difference in Concepts:
SMT is a subset of assembly technology that includes soldering and processes like assembly. Likewise, SMD is generally used in combination with other terms like component or part to indicate an electrical component.
Difference in Usage:
The SMT procedure is only suitable for surface-mount devices (SMDs), not through-hole ones. However, SMD components provide a more comprehensive range of soldering options for board installation.
Why Do Companies Prefer Combining SMD and SMT?
Earlier generations of surface-mount devices (SMDs) required electrical manufacturers to put and solder on smaller and more complicated components manually. Of course, machines could accomplish part of the work, but only certain kinds and sizes.
Now, it is easy to develop boards using SMT since the process is significantly quicker and more precise. In the past, soldering a component to a circuit board required placing tiny pieces of silver or lead on the board. Solder paste, consisting of flux and small amounts of solder, continues to use these components. Unlike human workers, who may be able to connect a few hundred SMDs per hour, SMT machines can join thousands. As a result, there is now an SMT equivalent to practically every through-hole procedure.
SMT&#;s ability to mass-produce circuit boards more quickly and cheaply led to the rise of surface-mount devices. Time and board space are both now optimized. The SMD allowed for a more compact and accurate device assembly to accomplish more work.
In addition, SMT would allow for faster and more precise assembly. More and more companies that produce electronics are using SMDs on an SMT due to the combined cost and time reductions.
How to Ensure Quality Control with the Help of Automated Optical Inspection?
In today&#;s competitive electronics market, electronic devices must be both high-quality and reliable. Defects may cause production delays, higher expenses, and, most significantly, damage the company&#;s reputation.
Thus, it is crucial to employ stringent testing standards all through the PCBA procedure, especially the use of automated optical inspection (AOI), to lessen the impact of these drawbacks.
AOI is an essential PCB testing procedure that can help find flaws and guarantee that the PCBAs are up to par. So, in the remaining part of this article, we will thoroughly describe the AOI test and its significance in PCBA manufacturing.
What Are the Major Elements of AOI?
Fast and accurate quality control of PCBs is made possible with the help of image processing technology, which plays a significant role in inspection. In order to guarantee that their goods are of the best quality, companies operating in the 3C industry use advanced cameras, top-quality lenses, and image-processing software.
The optical system serves a crucial role in an AOI system since it captures pictures of the target object. The system&#;s efficiency is proportional to the quality of these photos. The standard optical setup for an AOI includes a light source, lenses, and a camera.
Light Source
Product testing should take place in bright light conditions in the presence of a reliable light source. The success of flaw detection depends very much on the nature of the light source, the color of the light, and the orientation of the light source.
Depending on the task, an AOI system can use a single light source or many sources. There was a time when companies used to employ various lighting options. Today&#;s setup mainly uses halogen lights and LED arrays to get light that is both steady and consistent.
Also Read: Machine Vision Light Source Overview
Lenses
The system&#;s lenses focus the product&#;s reflected light onto the camera&#;s image sensor. To get clear photos, you need to have a collection of high-quality industrial lenses.
The image resolution of the AOI device determines the precision of information it can detect and record. In other words, resolution is crucial since it determines how quickly and precisely an examination can be performed.
Remember, the CCD imaging system is the foundation of the AOI system. The light source typically highlights the components under inspection. However, the important task, i.e., taking the picture, is performed by the lens, which then transmits it as a beam of light to the sensor. The quality of a pixel, or the quantity of information contained in a pixel, is mostly determined by the camera&#;s lighting system and lens.
That&#;s why it is highly important to choose a better lighting system and advanced lenses. After lighting source, the success of your inspection operation depends on the type of lens you choose.
Camera
The digital camera usually takes a picture of the product. AOI systems can use everything from simple 2D cameras to highly advanced 3D sensors. They receive light and transform it into digital data in millions of small cells called pixels. Algorithms inside the AOI&#;s software then use this information to do the inspection.
AOI 3D systems allow for rapid, comprehensive examination of complete circuits, vastly improving the efficiency and precision of quality control processes. Thus, you can rest assured that only the best quality items will leave the factory. The cutting-edge AOI technology can spot flaws that would otherwise go undetected by human inspectors.
If you use AOI 3D as part of your quality control procedure, you can be confident that your electrical devices will work as expected.
Final Thoughts!
Because of its lower production costs and shorter production times, SMT has replaced Through Hole Mounting. Now, SMT is the standard method of PCBA assembly in most electronics companies.
Moreover, electronic components have shrunk in size as manufacturers respond to consumer demand for more compact goods like mobile phones. Component assembly on circuit boards is one area that has evolved alongside other technological developments. Thanks to technological advancements, even little devices can now provide lightning-fast service.
Now is the time to leverage the power of optics, mechanics, and software. AOI is a cutting-edge technology that can replace human inspectors. As we know, even the smallest board might include thousands of soldered components in today&#;s competitive PCBA manufacturing environment. As a result, automatic optical inspection (AOI) is becoming more critical.
AOI technology helps businesses lower production costs, decrease waste, and increase yields by constantly assessing the quality of production while making adjustments to the process flow. Companies who want to improve their production skills and stay competitive in the market should consider investing in AOI systems.
One thing, though! When you plan to set up an AOI system in your production plants, make sure you support them with high-quality lenses. At VICOImaging, you will find a range of industrial lenses that are tailor-made to suit different industrial inspection operations. Our lenses improve efficiency while maintaining a high standard of quality. You can realize competence and cut down on wasted time spent on manual inspections by incorporating our optics into your manufacturing process.
Do you need guidance setting up the AOI system? Or do you need help picking suitable lens models for your existing AOI system? Make sure you get in touch with one of our executives.
1.SMD: Surface Mount "Device"
SMD means any "device" can used at SMT process or technology.
2.SMT: Surface Mount Technology
SMT means a technology can install electronic device on the PCB.
SMT stands for Surface Mount Technology, the entire technology of mounting and soldering electronic components, such as resistors, capacitors, transistors, integrated circuits, onto a printed circuit board or PCB. The components used are also referred to as surface-mount devices (SMD, surface-mount devices).
1.Components have no leads or only short leads
2.The main body of the component and the solder joint are on the same side of the PCB
1.miniaturization
2.No lead (flat or short lead)
3.Suitable for surface assembly on PCB
The full name of SMT and SMD are surface Mount Technology and Surface Mount Device. SMT means a technology about fix the device on the PCB(Printed Circuit Board). SMD means some kind of electronic components can apply Surface Mount Technology to fix the device on the PCB.
SMT improve the cell or other device can become smaller. In the beginning, electronic devices like cell were produced by THT, DIP. &#;THT, Through-Hole Technology&#;&#;DIP, Dual-In line Package). The electronic components were not produced very small, if using THT,DIP to fix on PCB. The electronic components size of THT,DIP are about 5mmx5mm. If using SMT , the electronic components size are about 0.4mmx0.2mm.
SMT technology is based on replacing those conventional electronic components by the wafer-type of electronic components and using in-tray for the packaging. At the same time, the conventional approach of drilling and insertion has been replaced by a speedy paste onto the surface of PCB. Moreover, the surface area of PCB has been minimized by developing a multiple layers of boards from a single layer of board.
SMT use solder paste to fix the SMD on PCB.
1. A PCB stencil is aligned on the surface of the boards and solder paste is applied using a squeegee to ensure the pads are coated with a uniform and controlled amount of solder paste.
2. Via a pick and place machine or hand placement, the components are mounted onto the boards in their respective locations. The wet solder paste will act as a temporary adhesive but it is still important to ensure that the boards are moved gently to prevent misalignment.
3. The boards are passed through a re-flow oven which subjects the boards to infrared radiation, melting the solder paste and forming solder joints.Then the boards are passed through an AOI machine, or Automatic Optic Inspection machine which runs a number of quality checks on the boards visually, such as component alignment and checking for solder bridges. The boards then proceed to further testing.
To use SMT for the product is for not only the market demand but also its indirect effect on cost reduction. SMT reduces the cost because of the following:
1. The required surface area and layers for PCB are reduced.
The required surface area of PCB for carrying the components is relatively reduced because the size of those assembling components has been minimized. Moreover, the material cost for PCB is reduced, and also there is no more processing cost of drilling for the through-holes. It is because the soldering of PCB in the SMD method is direct and flat instead of relying on pins of the components in DIP to pass through the drilled holes in order to be soldered to the PCB. In addition, the PCB layout becomes more effective in the absence of through-holes, and as a consequence, the required layers of PCB are reduced. For example, an originally four layers of a DIP design can be reduced to two layers by the SMD method. It is because when using the SMD method, the two layers of boards will be sufficient for fitting in all the wiring. The cost for two layers of boards is of course less than that of the four layers of boards.
2. SMD is more suitable for a big quantity of production
The packaging for SMD makes it a better choice for automatic production. Although for those conventional DIP components, there is also an automatic assembling facility, for example, the horizontal type of insertion machine, the vertical type of insertion machine, odd-form insertion machine, and IC inserting machine; nonetheless, the production at each time unit is still less than the SMD. As the production quantity increases for every working time, the unit of production cost is relatively reduced.
3. Fewer operators are required
Commonly, only about three operators are required per SMT production line, but at least 10 to 20 people are required per DIP line. By reducing the number of people, not only the manpower cost is reduced but also the management becomes easier.
For the SMT machine, first you need using Tape and reel to packaging your component. And the format need following EIA Standard, like dimension, pulling strength, the hole of carrier tape.
For the SMT machine, first you need using Tape and reel to packaging your component. And the format need following EIA Standard, like dimension, pulling strength, the hole of carrier tape.
Choosing the right carrier tape for your device is only half the battle. Selecting the proper cover tape is also important to protect components, minimize product loss, and ensure a smooth ride through the pick-and-place process.
Heat-activated adhesive (HAA) cover tapes are the most widely used in the electronic component industry. Historically, they have been the least expensive and most readily available cover tapes on the market and work well in many cases. In the taping process, a heated sealing shoe presses the tape onto the edges of the carrier tape on both sides of each device, sealing the cover tape to the carrier tape while leaving the component free from active adhesive. In the HAA taping process, time, heat, and pressure must be carefully controlled to achieve optimum adhesion.
Most component manufacturers are familiar with and comfortable using HAA cover tape. However, compared to some newer technologies, HAA tape may not be the optimal choice for certain applications. The HAA taping process is relatively slow. While that&#;s not generally a problem for bigger components, smaller components and more devices per inch of carrier tape can markedly slow the production line. Moreover, HAA cover tape peel force is relatively inconsistent compared to more advanced cover tapes (Figure 1). The peel force&#;s deep lows and high peaks can result in a relatively inconsistent de-taping force at the SMT assembly plant, potentially causing devices to pop out of their carrier tape pockets &#; known as trampolining &#; and slowing down production. HAA cover tape&#;s adhesive can also be affected by time, temperature, and humidity.
For smaller devices, a pressure-sensitive adhesive (PSA) cover tape may offer a better alternative to HAA tape. As the name implies, PSA tape adheres when pressure is applied; heat is not required to activate the cover tape.
For more Factory Wholesale Box Turning Conveyor Belt Equipmentinformation, please contact us. We will provide professional answers.
Related links:PSA tapes are designed to provide a smoother peel force (Figure 2), minimizing trampolining and increasing production speed regularity. PSA adhesive are also less affected by time and weather conditions. Moreover, because heat is not required, PSA cuts down on energy costs at the component packing stage. The drawback to PSA tapes is that they leave a residue that can build up in SMT feeders over time. This can be mitigated through regular placement equipment cleaning and minor retrofits, which tape suppliers should be able to suggest.
&#;Heat Activated Type (HAA)
1. Normal Type
2. Transparent Type
3. Conductive Type
Read More About "Heat Activated Cover Tape"&#;Pressure Sensitive Adhesives Sensitive (PSAs)
1. Normal Type
2. Conductive Type
3. Heat-Resisting Type
Read More About "PSA Cover Tape"Want to know more, Welcome to Contact us
1. Carrier Tape of 8 mm has to be used with Cover tape of 5.4mm.
2. Carrier Tape of 12 mm has to be used with Cover tape of 9.3mm.
3. Carrier Tape of 16 mm has to be used with Cover tape of 13.3mm.
4. Carrier Tape of 24 mm has to be used with Cover tape of 21.3mm.
5. Carrier Tape of 32 mm has to be used with Cover tape of 25.5mm.
6. Carrier Tape of 44 mm has to be used with Cover tape of 37.5mm.
7. Carrier Tape of 56 mm has to be used with Cover tape of 49.5mm.
8. Carrier Tape of 72 mm has to be used with Cover tape of 65.5mm.
9. Carrier Tape of 88 mm has to be used with Cover tape of 81.3mm.
SMT&#;SMT: surface Mount Technology&#;
SMD&#;SMD: surface Mount Device&#;
DIP&#;Dual In-line Package&#;
4.11 in EIA Standard-D:
The cover tape for each style and material of carrier tape shall have a total peel strength of from 0.1 N to 1.0 N (10 grams to 100 grams calibrated scale reading) for 8 mm carrier tapes and 0.1N to 1.3 N (10 grams to 130 grams calibrated scale reading) for 12 mm to 56 mm wide carrier tapes and from 0.1N to 1.5 N (10 grams to 150 grams calibrated scale reading) for 72 mm and wider carrier tapes. Peel is defined as the separation of the full width of the cover tape from the carrier tape or the removal of the center portion of the cover tape from the carrier tape to enable component removal from the cavity. The direction of pull shall be opposite the direction of carrier tape travel such that the cover tape makes an angle of between 165 and 180 degrees with the top of the carrier tape. The cover tape, shall be pulled with a velocity of 300 mm±10 mm/minute, relative to the carrier tape, during peeling, which results inthe cover/carrier tape seal being separated at a rate of 150 mm/minute.
Cover tape still can call: tape and reel, tape reel, SMD package, semiconductor tape, reel to reel, SMD reels, reel to reel tape, tape and reel packaging, electric reel, tape & reel packagin , , , A for semiconductor packaging, component packaging
Cover tape combine with carrier tape and use for package the semiconductor(IC) or Passive components seal electrical and electronic components, it have anti-static layers can anti-static(ESD) during packing, transport and storage. Both PSA and HAA cover tapes can be found in nonconductive and static-dissipative versions. Some cover tapes are termed anti-static which are usually perceived as being the same as static-dissipative cover tapes. Technically, antistatic refers to a material which does not generate a static charge when rubbed against a second material (triboelectric charging). Static dissipative refers to a material which can bleed off a charge through the mechanism which provides it&#;s surface resistivity.
When sealing an HAA cover tape, temperature refers to the indicated temperature of the sealing mechanism. Heat activated adhesives are dry to the touch at room temperature. The absence of any tackiness is the property that permits their ready handling under these conditions. Tackiness must be attained to get the adhesive to &#;stick&#; the cover tape to the carrier tape. To accomplish this, energy in the form of heat is used to &#;activate&#; the cover tape&#;s adhesive system. This activation is the process that raises the temperature of the adhesive until it achieves a level of tackiness which allows it to adhere to the carrier tape. But PSA cover tapes require different processing and handling than heat activated cover tapes and are generally considered to be easier to seal than their heat activated counterparts. The PSA adhesive is a synthetic adhesive formulated to remain tacky over a wide range of temperatures, including room temperature. Hence, PSA cover tapes require no heat to seal them to the carrier. To prevent components from sticking to the adhesive, a liner film is added to cover the adhesive in the center portion of the cover tape.
Force-One is a manufacturer of optical film in Taiwan. Our procducts of tape and reel have high quality, nice price can fit what you want. Our cover tpae have more than 20 kinds for our customers, like: anti-static type, difference adhesive force, difference color, anti-high temporture. We can customized what you need, welcome to contact us.
Force-One's cover tape have very stable peeling strength for PS or PC carrier tape as below.
Width: 5.4mm, 9.3mm, 13.3mm, 21.3mm, 25.5mm, 37.5mm, 49.5mm, 65.5mm, 81.5mm
The Benefits&#;
1.PET with Pressure Sensitive Adhesives combined with brown or Transparent anti-static film.
2.Excellent and stable quality . The aging (60&#; / 720hrs) and peeling force test had passed.
3.The value of anti-static is 10^9~11, It can prevent ESD issue.
4.Excellent sealing. Can meet any carrier tape of PC, PS, PET to seal.
5.Thickness: 60 ± 5 um. Can anti high temperatures before vacuum packaging ( 80&#;) without peeling issue.
The Benefits&#;
1.PET with Pressure Sensitive Adhesives combined with brown or Transparent anti-static film.
2.Excellent and stable quality . The aging (60&#; / 720hrs) and peeling force test had passed.
3.The value of anti-static is 10^9~10^11, Adhesive is 10^8~10 It can prevent ESD issue.
4.Excellent sealing. Can meet any carrier tape of PC, PS, PET to seal.
5.Thickness: 60 ± 5 um. Can anti high temperatures before vacuum packaging (120&#;) without peeling issue.
Want to know more, Welcome to Contact us
Read About "Sealing Heat Cover Tape"
>Cutting Line:
===The Introduction of Force-One's Cover Tape===
Force-One's is uniquely designed to peel through the film itself and available as static dissipative.The cover tapes for semiconductor(IC) or Passive components seal electrical and electronic components into Carrier Tapes, it have anti-static layers can anti-static(ESD) during packing, transport and storage. The cover tapes for semiconductor could combine excellent sealing properties with smooth peel force to protect IC or Passive components and permit efficient pick-and-place operations. The full line of Force-One's Cover Tapes includes conductive, non-conductive and static dissipative products with heat activated or pressure-sensitive adhesive.
Both PSA and HAA cover tapes can be found in non-conductive and static-dissipative versions. Some cover tapes are termed anti-static which are usually perceived as being the same as static-dissipative cover tapes. Technically, anti-static refers to a material which does not generate a static charge when rubbed against a second material (triboelectric charging). Static dissipative refers to a material which can bleed off a charge through the mechanism which provides it&#;s surface resistivity. A non-conductive material is defined as having a surface resistivity (Rs) greater than 10^12 ohms/square. Static dissipative material is defined as having a surface resistivity (Rs) between 10^5 ohms/square and 10^12 ohms/square. While conductive material is defined as having a surface resistivity (Rs) of less than 10^5 ohms/square.
The cover tapes(Tape & Reel) for semiconductor(IC) or Passive components is good for SMD/SMT(Surface-Mount Device / Surface-Mount Technology) process. And can anti-static cover tape for packaging of surface mount devices (ESD protection).
Common TDS: Thin:0.05~0.06 mm ; Transmittance: 60%~89% ; Haze: 3%~30% ; Anti-static: &#;10^9-11Ω/sq ; Working temperature:140&#; - 190&#; ; RA pass:55&#;~60&#;/720 hrs
Width: 5.4mm, 9.3mm, 13.3mm, 21.3mm, 25.5mm, 37.5mm, 49.5mm, 65.5mm, 81.5mm
&#;Heat Activated Type (HAA)
1. Normal Type
2. Transparent Type
3. Conductive Type
Read More About "Heat Activated Cover Tape"&#;Pressure Sensitive Adhesives Sensitive (PSAs)
1. Normal Type
2. Conductive Type
3. Heat-Resisting Type
Read More About "PSA Cover Tape"Want to know more, Welcome to Contact us
For any heat-activated adhesive cover tape, as a general rule,increasing temperature, dwell time, and pressure on a given sealing machine will, within limits, increase adhesion (peel). However, for most of the HAA cover tapes available in the marketplace today, temperature and dwell will have a greater affect on adhesion than pressure. The ways these variables interact in the sealing process are of interest to anyone trying to control a packaging process.
>Normal Type Cover Tape
Similar as Common TDS
>Transparent Type Cover Tape
Special TDS: Transmittance: 89%
>Conductive Type Cover Tape
Special TDS: PET's anti-static: &#;10^5-10Ω/sq ; Adhesive anti-static: &#;10^9Ω/sq
Read More About "Sealing Heat Cover Tape"
PSA cover tapes require different processing and handling than heat activated cover tapes and are generally considered to be easier to seal than their heat activated counterparts. The PSA adhesive is a synthetic adhesive formulated to remain tacky over a wide range of temperatures, including room temperature. Hence, PSA cover tapes require no heat to seal them to the carrier. To prevent components from sticking to the adhesive, a liner film is added to cover the adhesive in the center portion of the cover tape. PSA cover tapes are slightly more complex in their cons
>Normal Type-Cover Tape
Similar as Common TDS
>Conductive Type Cover Tape
Special TDS: Adhesive anti-static:&#;10^3-5Ω/sq
>Heat-Resisting Type Cover Tape
Special TDS: Can Heat-Resisting: 125&#;/8hr or 50&#;/24hr
Read More About "PSA Cover Tape"
Want to know more, Welcome to Contact us
==========================
Cover tape combine with carrier tape and use for package the semiconductor(IC) or Passive components seal electrical and electronic components, it have anti-static layers can anti-static(ESD) during packing, transport and storage. Both PSA and HAA cover tapes can be found in nonconductive and static-dissipative versions. Some cover tapes are termed anti-static which are usually perceived as being the same as static-dissipative cover tapes. Technically, antistatic refers to a material which does not generate a static charge when rubbed against a second material (triboelectric charging). Static dissipative refers to a material which can bleed off a charge through the mechanism which provides it&#;s surface resistivity.
When sealing an HAA cover tape, temperature refers to the indicated temperature of the sealing mechanism. Heat activated adhesives are dry to the touch at room temperature. The absence of any tackiness is the property that permits their ready handling under these conditions. Tackiness must be attained to get the adhesive to &#;stick&#; the cover tape to the carrier tape. To accomplish this, energy in the form of heat is used to &#;activate&#; the cover tape&#;s adhesive system. This activation is the process that raises the temperature of the adhesive until it achieves a level of tackiness which allows it to adhere to the carrier tape. But PSA cover tapes require different processing and handling than heat activated cover tapes and are generally considered to be easier to seal than their heat activated counterparts. The PSA adhesive is a synthetic adhesive formulated to remain tacky over a wide range of temperatures, including room temperature. Hence, PSA cover tapes require no heat to seal them to the carrier. To prevent components from sticking to the adhesive, a liner film is added to cover the adhesive in the center portion of the cover tape.
REFERENCES:FUNDAMENTALS OF PSA AND HEAT ACTIVATED COVER TAPE SEALING FOR COMPONENTS PACKAGED IN TAPE AND REEL
, , A
Force-One Applied Materials CO., LTD. is a professional optical film manufacturer. And have know how of formulas. We can meet difference specifications for every customer with high quality. Our customers are all over the world include America ,India , China ,Taiwan , Malaysia , Philippines, Singapore, Thailand, Vietnam, Indonesia.
Contact us to discuss your requirements of Automated Guided Vehicle Components. Our experienced sales team can help you identify the options that best suit your needs.
Previous: What you need to know about aerial work platforms?
Next: Scrap Metal Crusher: Hydraulic vs Electric - Which Is Best?
If you are interested in sending in a Guest Blogger Submission,welcome to write for us!
All Comments ( 0 )