Low-Pressure vs. High-Pressure Overmolding

Author: Ruby

Sep. 02, 2024

Hardware

Low-Pressure vs. High-Pressure Overmolding

Manufacturers use a few different techniques to overmold, seal and protect cables and electrical connectors from moisture, dust, debris, vibration and strain. The two most popular overmolding techniques are &#;low-pressure&#; and &#;high-pressure.&#; Each technique has its pros and cons, but ultimately, the method a manufacturer chooses to use for overmolding depends on the type of electrical assembly and application.

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The Overmolding Process

High- and low-pressure overmolding techniques follow a similar process, which involves melting adhesive thermoplastic polyamide materials in a large hopper, placing the cable and connector components in an enclosed mold, and injecting the mold with the molten material to encapsulate the cable and connector, resulting in one unified product.

High-Pressure Overmolding

As the name suggests, high-pressure overmolding injects molten material into the mold at a higher temperature (185-300+°C), and pressure (around 25,000 PSI) compared to low-pressure overmolding. Higher pressure equates to faster injection time or time needed to fill the mold cavity, which allows manufacturers to produce more overmolded cables in less time. The material viscosity of high-pressure overmolding is comparable to taffy (around 5 grams over 10 minutes).

Common Applications:

  • PCB housings
  • Plastic parts
  • Medical Devices
  • Auto Dashboards

Pros:

  • Fast cycle time
  • Greater efficiency
  • Greater durability
  • Ideal for high-volume orders

Cons:

  • Higher melt temperature and pressure can damage delicate electrical components.
  • Material viscosity can shear off components.
  • Faster fill-rate can produce flaws or &#;molded-in stresses,&#; uniformity issues, flow-front hesitation, and other issues that can impact quality, performance and aesthetics.

Low-Pressure Overmolding

Low-pressure overmolding uses a lower melt temperature (180-220°C) and less pressure (around 100 PSI) when injecting molten material into a mold cavity. These less abrasive manufacturing elements make low-pressure overmolding ideal for delicate electrical equipment, such as sensors and PCBs, which can easily become damaged if exposed to a higher pressure and temperature. The other quality that sets low-pressure overmolding apart from other techniques, including high-pressure overmolding, is its use of low-viscosity polyamide resins, which resemble the consistency of syrup (2,000&#;10,000 mPa&#;s (cP)). This low-viscosity material can easily fill intricate, hard-to-reach cavities without requiring additional pressure, allowing manufacturers to mold thinner walls with less freeze-off.

Common Applications:

  • PCBs
  • Sensors
  • Switches
  • Batteries

Pros:

  • Gentle on delicate electronics
  • Greater uniformity
  • Excellent precision for complex designs
  • Better aesthetics
  • Eliminates front-flow hesitation

Cons:

  • Slower cycle time (relative to high-pressure molding)
  • Less durable (compared to high-pressure molding)

Overall Benefits of Pressure Molding

  • Lower cost of ownership
  • Less material consumption
  • Less equipment and operations footprint
  • Lower cycle time per part
  • Fewer manufacturing steps
  • More environmentally friendly
  • Higher quality outcomes
  • Excellent resistance and protection

In either case, injection molding is the superior manufacturing technique for overmolding electrical cables and connectors compared to other approaches, such as potting, which requires more resources, time, equipment and steps to produce a less-superior product.

To learn more about overmolding electronics, download our free guide.

A Comprehensive Guide to Low Pressure Injection Molding

Low pressure injection molding (LPM) is a specialized subset of traditional injection molding, distinguished by its use of lower pressure to inject the material into the mold. It is crucial in several industries due to its unique advantages. In this post, we will dive into low pressure injection molding, and explore the benefits, applications, and challenges of this manufacturing process.

What is Low Pressure Injection Molding?

Low pressure injection molding is a process where molten plastic material is injected into a mold cavity at relatively low pressures, typically ranging from 1.5 to 40 bar (21.8 to 580 psi). The pressure of low pressure injection molding is 0.15~4Mpa. It works by melting a plastic material and then injecting it slowly into a mold using low pressure. The low pressure allows the molten plastic to flow gently into the mold cavity without excessive force that could damage the mold or the part being produced.

Key Aspects of the Low Pressure Injection Molding Process:

  • Uses much lower pressures (1.5-40 bar) compared to traditional injection molding (350- bar).
  • Lower processing temperatures, typically 180-240°C vs 230-300°C for high pressure molding.
  • Can use aluminum molds instead of steel due to lower pressures.
  • Often uses hot melt materials like polyamides or polyolefins.
  • Cycle times are short, usually 15-60 seconds total.
  • Provides good adhesion between the molded material and encapsulated components.
  • Allows for delicate overmolding of fragile electronic parts without damage.
  • This process is particularly well-suited for encapsulating electronic components, creating waterproof seals, and producing parts with integrated fabrics or skins.

The Key Steps of Low Pressure Injection Molding Process

The process of low pressure injection molding typically involves the following steps:

1. Insert:
The electronic components or parts to be encapsulated are inserted into the mold cavity. This usually takes about 5-10 seconds to load.

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If you are looking for more details, kindly visit low pressure overmolding for electronics.

2. Overmolding:
The low pressure molding machine injects the molten material (usually a thermoplastic) into the mold at low pressure (typically 1.5-40 bar).

The material flows around and encapsulates the inserted components.

This step takes about 15-60 seconds.

3. Cooling and Ejection:
The molded part is allowed to cool and solidify. Once cooled, the part is ejected from the mold. The finished part can be handled and tested immediately after molding.

What is the Purpose of the Low Pressure Injection Molding?

Low Pressure Injection Molding (LPIM) is a manufacturing process primarily used to enable the efficient production of complex and delicate parts, especially those that cannot tolerate high injection pressures or temperatures. It is particularly effective for encapsulating and protecting electronic components, delicate parts, and assemblies.

Common Used Low Pressure Injection Molding Materials

Low pressure injection molding is compatible with various materials, each offering specific advantages depending on the application. Here&#;s an overview of the types of low pressure molding materials and their advantages.

Thermoplastics:

  • Polyamides (Nylons)
  • Polyolefins (Polyethylene, Polypropylene)
  • Polyurethanes (PU)
  • Polycarbonates (PC)
  • Polyvinyl chloride(PVC)

Thermosets:

  • Epoxy Resins
  • Silicones
  • Phenolics

Those plastic materials have higher mechanical strength, chemical resistance, thermal stability, flexibility impact resistance and electrical insulation. All these low pressure molding materials are suitable for electronics related product applications for UV light resistance, thermal stability, solvent resistance, and chemical resistance.

Examples of Low Pressure Molding

The low pressures (typically 1.5-40 bar) and temperatures used in the low pressure injection molding process make it ideal for encapsulating or overmolding sensitive components without damaging them. It&#;s particularly useful for creating waterproof seals, providing protection against shock, vibration, moisture, and corrosive agents, and integrating different materials like fabrics or PVC skins directly onto plastic parts.

Electronic Component Encapsulation:

  • Circuit board protection
  • Connectors containing PCBAs
  • Wire harnesses and cables
  • Waterproof connectors
  • Sensors
  • Microswitches
  • Inductors
  • Antennas

Overmolding of Fragile Components:

  • Antennas (enhances radio signal while protecting)
  • Circuit boards
  • Magnets
  • Batteries
  • Threaded inserts
  • Metal rods, bolts, and clips

Medical Devices:

Encapsulation of sensitive electronic components

Advantages and Disadvantages of Low Pressure Injection Molding

Advantages of Low Pressure Injection Molding

  1. High Strength: The skin material bonds seamlessly with the plastic base, ensuring there is no risk of separation.
  2. High Molding Efficiency: The process is more environmentally friendly as it eliminates the need for adhesive application required in cladding processes.
  3. Design Flexibility: Offers greater freedom in internal structure and surface modeling compared to cladding processes, resulting in clearer design features, enhanced aesthetics, and improved comfort.

Disadvantages of Low Pressure Injection Molding

  1. Complex Process: The low-pressure molding process is more intricate, making it susceptible to the influence of mold quality and material ductility, which can lead to a higher scrap rate.
  2. Limited Pattern Retention: Under high stretch, the three-dimensional quality of patterns may be compromised.
  3. Higher Costs: The tooling and material costs are higher, leading to increased overall expenses.
  4. The tooling and material costs are higher, leading to increased overall expenses.

Key Considerations for Low Pressure Injection Molding

Successful low pressure injection molding (LPIM) requires careful consideration of several factors, including resin selection, mold design, and process parameters.

Select High Fluidity Resin

Ductility and fluidity are critical properties for the resin to flow smoothly into the mold cavity and around inserts/components. Polyamides (PA) and polyolefins are commonly used for their high fluidity, thermal stability (180-240°C range), and adhesion properties. Bio-based polyamides derived from renewable sources like plant oils offer sustainability benefits. Resin viscosity and filler content impact flow behavior and must match part geometry.

Optimize Mold Gating and Venting Design

Proper gating (inlets for injecting resin) and venting (outlets for air escape) are essential for uniform filling without knit lines or voids. Gating should direct resin flow into thin sections first, with vents at last points to fill. Venting allows trapped air to escape as the resin flows through the cavity. Mold materials like aluminum or silicone rubber accommodate lower pressures versus steel tooling.

Control Process Parameters

Melt temperatures typically range from 180-240°C based on the resin. Injection pressures are low, from 1.5 to 40 bar, to gently fill the mold cavity. Injection speed must be optimized &#; too fast causes air traps, too slow allows premature freezing. Holding pressure and cooling time are adjusted to achieve complete filling and part quality.

Common Defects and Troubleshooting

Here are some common defects in low pressure injection molding and potential solutions:

Breakdown at Sharp Corners

  1. This defect occurs when the molten plastic fails to completely fill sharp internal corners or edges within the mold cavity.
    Solutions:
    Increase melt and mold temperatures to improve plastic flow.
  2. Increase injection pressure slightly to better fill tight areas.
  3. Modify part design to add radii to sharp corners where possible.

Flow Marks or Knit Lines

  1. Flow marks are visible lines or knit lines on the part surface caused by the merging of separate melt flow fronts.
    Solutions:
    Optimize gate location and number of gates to direct uniform melt flow.
  2. Increase melt and mold temperatures for better flow.
  3. Adjust venting to allow trapped air to escape smoothly.

Air Entrapment or Burning

  1. Air can get trapped in the mold cavity, resulting in voids, burns or degraded material properties.
    Solutions:
    Improve venting channels and locations in the mold design.
  2. Adjust injection speed &#; too fast causes air traps, too slow allows premature freezing.
  3. Ensure proper mold venting maintenance and cleaning.

How Low Pressure Molding Differs from Traditional Injection Molding

Here are the key differences between low pressure injection molding and traditional injection molding:

Injection Pressure

  • Low pressure moulding uses injection pressures ranging from 1.5 to 40 bar (21.8 to 580 psi)
  • Traditional injection molding uses much higher pressures, typically 350 to bar (5,000 to 18,800 psi)

Molding Temperatures

  • Low pressure molding operates at lower temperatures around 180-240°C
  • Traditional high pressure molding uses higher temperatures, typically 230-300°C

Mold Materials

  • Low pressure uses lower-cost aluminum or silicone rubber molds
  • Traditional high pressure requires more expensive steel mold tooling to withstand the extreme pressures

Resin Properties

  • Low pressure resins like polyamides (PA) have high fluidity to flow at low pressures
  • Traditional high pressure resins have lower fluidity but can fill complex geometries

Part Adhesion and Sealing

  • low pressure moulding is the ability to gently overmold and encapsulate delicate components like PCBs and connectors without damage from extreme pressures and temperatures.
  • Traditional high pressure parts often have poorer adhesion and sealing capabilities compared to low pressure molding.

Production Volume

  • Low pressure is well-suited for low to medium volume production runs.
  • Traditional high pressure injection molding favors medium to high volume manufacturing.

Conclusion

Low pressure injection molding offers a unique and advantageous approach for encapsulating delicate components, achieving excellent sealing properties, and producing complex thin-wall geometries. Operating at much lower pressures and temperatures than traditional injection molding, this process provides significant cost, quality, and sustainability benefits. From automotive interior trim to industrial cable sealing, low pressure molding enables innovative applications across sectors. Its suitability for low to medium production volumes makes it an economical choice for encapsulating specialized components and customized products.

Are you interested in learning more about low pressure overmolding suppliers? Contact us today to secure an expert consultation!

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